Share Email Print
cover

Proceedings Paper

Novel silicon/aluminum (Si/Al) alloys for use as cold plate materials in cryogenically cooled solid state lasers
Author(s): John F. Schill; Andrew J. W. Ogilvy
Format Member Price Non-Member Price
PDF $17.00 $21.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

The issue of heat transfer in high energy lasers has been a serious problem for years. One valid method of mitigating this problem is the use of low quantum defect solid-state materials operated at cryogenic temperatures1. A significant problem exists due to mismatch of coefficient of thermal expansion (CTE) and repeatedly cycling through a temperature range of ~200 K. Other groups, T.Y. Fan et al at MIT Lincoln Laboratory, have used ingenious crystal holders to overcome this problem. In this paper, we suggest the use of silicon/aluminum (Si/Al) alloys produced by Sandvik Osprey Ltd. that can have their CTE altered easily to match the CTE of whatever crystal material is chosen and still have a thermal transfer coefficient suitable for large heat transfer. We show the results of testing three different Si/Al alloys for CTE and thermal conductivity. We further test the material in a flow boil-off cryogenic cooling system that shows that the CE6 alloy material is capable of heat transfer of 21.5KW/m2K , with cold plate temperatures maintained below 110 K. The CE6 material has a CTE that almost exactly matches YAG from 90--300K.

Paper Details

Date Published: 7 May 2012
PDF: 8 pages
Proc. SPIE 8381, Laser Technology for Defense and Security VIII, 83811P (7 May 2012); doi: 10.1117/12.921085
Show Author Affiliations
John F. Schill, U.S. Army Research Lab. (United States)
Andrew J. W. Ogilvy, Sandvik Osprey Ltd. (United Kingdom)


Published in SPIE Proceedings Vol. 8381:
Laser Technology for Defense and Security VIII
Mark Dubinskii; Stephen G. Post, Editor(s)

© SPIE. Terms of Use
Back to Top