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Proceedings Paper

Temperature and pressure sensors based on chiral fibers
Author(s): Jongchul Park; Mitchell S. Wlodawski; Jonathan Singer; Daniel Neugroschl; Azriel Z. Genack; Victor I. Kopp
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Paper Abstract

We have fabricated both pressure and temperature sensors based on chiral fiber gratings that can operate in harsh environments over wider measurement ranges than conventional fiber Bragg gratings (FBGs). Chiral fiber sensors are made by twisting one or more standard or custom optical fiber with a noncircular or non-concentric core as they pass though a miniature heat zone. Because the resulting structures are as stable as the glass material, they can operate in harsh environments. Excellent temperature stability up to 900°C is found in pure silica chiral fiber temperature sensors. We developed a correlation algorithm for use with a standard FBG interrogator to accurately measure the shift in the transmission spectrum as the environment of the sensor changes. We developed a calibration procedure, which allows the chiral temperature sensor to operate at temperatures from 200 to 900°C with a maximum difference in temperature reading from a calibrated thermocouple of +/- 2°C. We have fabricated a transducerless pressure sensor (i.e. no moving parts) operating from 1 atm. (14.7 psi) up to 12 kpsi with a resolution of 1 psi that can operate at temperatures as high as 700°C.

Paper Details

Date Published: 4 May 2012
PDF: 8 pages
Proc. SPIE 8370, Fiber Optic Sensors and Applications IX, 837008 (4 May 2012); doi: 10.1117/12.920324
Show Author Affiliations
Jongchul Park, Chiral Photonics, Inc. (United States)
Mitchell S. Wlodawski, Chiral Photonics, Inc. (United States)
Jonathan Singer, Chiral Photonics, Inc. (United States)
Daniel Neugroschl, Chiral Photonics, Inc. (United States)
Azriel Z. Genack, Chiral Photonics, Inc. (United States)
Queen's College of The City Univ. of New York (United States)
Victor I. Kopp, Chiral Photonics, Inc. (United States)

Published in SPIE Proceedings Vol. 8370:
Fiber Optic Sensors and Applications IX
Henry H. Du; Gary Pickrell; Eric Udd, Editor(s)

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