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Proceedings Paper

Yield enhancement with DFM
Author(s): Seung Weon Paek; Jae Hyun Kang; Naya Ha; Byung-Moo Kim; Dae-Hyun Jang; Junsu Jeon; DaeWook Kim; Kun Young Chung; Sung-eun Yu; Joo Hyun Park; SangMin Bae; DongSup Song; WooYoung Noh; YoungDuck Kim; HyunSeok Song; HungBok Choi; Kee Sup Kim; Kyu-Myung Choi; Woonhyuk Choi; JoongWon Jeon; JinWoo Lee; Ki-Su Kim; SeongHo Park; No-Young Chung; KangDuck Lee; YoungKi Hong; BongSeok Kim
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Paper Abstract

A set of design for manufacturing (DFM) techniques have been developed and applied to 45nm, 32nm and 28nm logic process technologies. A noble technology combined a number of potential confliction of DFM techniques into a comprehensive solution. These techniques work in three phases for design optimization and one phase for silicon diagnostics. In the DFM prevention phase, foundation IP such as standard cells, IO, and memory and P&R tech file are optimized. In the DFM solution phase, which happens during ECO step, auto fixing of process weak patterns and advanced RC extraction are performed. In the DFM polishing phase, post-layout tuning is done to improve manufacturability. DFM analysis enables prioritization of random and systematic failures. The DFM technique presented in this paper has been silicon-proven with three successful tape-outs in Samsung 32nm processes; about 5% improvement in yield was achieved without any notable side effects. Visual inspection of silicon also confirmed the positive effect of the DFM techniques.

Paper Details

Date Published: 15 March 2012
PDF: 19 pages
Proc. SPIE 8327, Design for Manufacturability through Design-Process Integration VI, 832704 (15 March 2012); doi: 10.1117/12.920029
Show Author Affiliations
Seung Weon Paek, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Jae Hyun Kang, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Naya Ha, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Byung-Moo Kim, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Dae-Hyun Jang, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Junsu Jeon, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
DaeWook Kim, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Kun Young Chung, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Sung-eun Yu, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Joo Hyun Park, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
SangMin Bae, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
DongSup Song, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
WooYoung Noh, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
YoungDuck Kim, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
HyunSeok Song, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
HungBok Choi, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Kee Sup Kim, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Kyu-Myung Choi, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Woonhyuk Choi, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
JoongWon Jeon, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
JinWoo Lee, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Ki-Su Kim, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
SeongHo Park, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
No-Young Chung, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
KangDuck Lee, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
YoungKi Hong, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
BongSeok Kim, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)


Published in SPIE Proceedings Vol. 8327:
Design for Manufacturability through Design-Process Integration VI
Mark E. Mason, Editor(s)

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