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Proceedings Paper

Highly precise and robust packaging of optical components
Author(s): Michael Leers; Matthias Winzen; Erik Liermann; Heinrich Faidel; Thomas Westphalen; Jörn Miesner; Jörg Luttmann; Dieter Hoffmann
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Paper Abstract

In this paper we present the development of a compact, thermo-optically stable and vibration and mechanical shock resistant mounting technique by soldering of optical components. Based on this technique a new generation of laser sources for aerospace applications is designed. In these laser systems solder technique replaces the glued and bolted connections between optical component, mount and base plate. Alignment precision in the arc second range and realization of long term stability of every single part in the laser system is the main challenge. At the Fraunhofer Institute for Laser Technology ILT a soldering and mounting technique has been developed for high precision packaging. The specified environmental boundary conditions (e.g. a temperature range of -40 °C to +50 °C) and the required degrees of freedom for the alignment of the components have been taken into account for this technique. In general the advantage of soldering compared to gluing is that there is no outgassing. In addition no flux is needed in our special process. The joining process allows multiple alignments by remelting the solder. The alignment is done in the liquid phase of the solder by a 6 axis manipulator with a step width in the nm range and a tilt in the arc second range. In a next step the optical components have to pass the environmental tests. The total misalignment of the component to its adapter after the thermal cycle tests is less than 10 arc seconds. The mechanical stability tests regarding shear, vibration and shock behavior are well within the requirements.

Paper Details

Date Published: 22 February 2012
PDF: 6 pages
Proc. SPIE 8244, Laser-based Micro- and Nanopackaging and Assembly VI, 824404 (22 February 2012); doi: 10.1117/12.920016
Show Author Affiliations
Michael Leers, Fraunhofer Institute for Laser Technology (Germany)
Matthias Winzen, Fraunhofer Institute for Laser Technology (Germany)
Erik Liermann, Fraunhofer Institute for Laser Technology (Germany)
Heinrich Faidel, Fraunhofer Institute for Laser Technology (Germany)
Thomas Westphalen, Fraunhofer Institute for Laser Technology (Germany)
Jörn Miesner, Fraunhofer Institute for Laser Technology (Germany)
Jörg Luttmann, Fraunhofer Institute for Laser Technology (Germany)
Dieter Hoffmann, Fraunhofer Institute for Laser Technology (Germany)


Published in SPIE Proceedings Vol. 8244:
Laser-based Micro- and Nanopackaging and Assembly VI
Friedrich G. Bachmann; Wilhelm Pfleging; Kunihiko Washio; Jun Amako; Willem Hoving; Yongfeng Lu, Editor(s)

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