Share Email Print
cover

Proceedings Paper

Formation of GaN film on Si for microbolometer
Author(s): Yong Soo Lee; Dong-Seok Kim; Chul-Ho Won; Jong-Hoon Kim; Chan-Ho Bu; Sung-Ho Hahm; Young-Chul Jung; Jung-Hee Lee
Format Member Price Non-Member Price
PDF $17.00 $21.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

In this report, we describe thin 200nm thick GaN film formation technology on Si which allows microbolometer application. GaN layer with AlN buffer layer obtained by the MOCVD has TCR of about -0.64 %/°C and sheet resistance of ~2800 ohm/sq. Acquired GaN films were analyzed by XRD, SEM, Hall measurement, and etc. The successful growth of thin single crystalline or polycrystalline GaN film on Si can be a good semiconductor bolometric material. And the multi wavelength detecting systems with GaN based devices including UV detector, power devices, amplifier with GaN and AlGaN MOSFET, HEMT, and etc can be realized. We obtained thin(~200nm) crystalline GaN layer on Si(111) with AlN buffer layers with FWHM(full width at half maximum) of ~1800 arcsec. And its bolometric characteristic was analyzed.

Paper Details

Date Published: 31 May 2012
PDF: 7 pages
Proc. SPIE 8353, Infrared Technology and Applications XXXVIII, 835318 (31 May 2012); doi: 10.1117/12.919072
Show Author Affiliations
Yong Soo Lee, Kyungpook National Univ. (Korea, Republic of)
Dong-Seok Kim, Kyungpook National Univ. (Korea, Republic of)
Chul-Ho Won, Kyungpook National Univ. (Korea, Republic of)
Jong-Hoon Kim, Kyungpook National Univ. (Korea, Republic of)
Chan-Ho Bu, Kyungpook National Univ. (Korea, Republic of)
Sung-Ho Hahm, Kyungpook National Univ. (Korea, Republic of)
Young-Chul Jung, Kyeongju Univ. (Korea, Republic of)
Jung-Hee Lee, Kyungpook National Univ. (Korea, Republic of)


Published in SPIE Proceedings Vol. 8353:
Infrared Technology and Applications XXXVIII
Bjørn F. Andresen; Gabor F. Fulop; Paul R. Norton, Editor(s)

© SPIE. Terms of Use
Back to Top