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Proceedings Paper

Technology review for silicon imagers-based see-through-silicon inspection and metrology
Author(s): Wei Zhou; Max Guest; Darcy Hart
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Paper Abstract

Semiconductor see-through-silicon metrology and inspection applications use traditionally InGaAs based cameras due to perfect spectral sensitivity. But InGaAs cameras do not carry equivalent advantages as Silicon based imagers such as pixel size, pixel array resolution and through-put etc. This paper first reviews the novel technologies which dramatically enhance silicon imagers' sensitivity for this see-through silicon application. Inspection through-put is analyzed based on multiple system implementation:, start-stop scan mode vs. continuous scan mode, 2D cameras vs. TDI line scan cameras, against to traditional InGaAs camera based continuous scan platform. The simulation data shows that systematic through-put based on 2D silicon cameras can be competitive to today's InGaAs system, while TDI line scan system can be much faster than system based on near future's high resolution and high speed InGaAs cameras.

Paper Details

Date Published: 6 April 2012
PDF: 6 pages
Proc. SPIE 8324, Metrology, Inspection, and Process Control for Microlithography XXVI, 83241Q (6 April 2012); doi: 10.1117/12.918500
Show Author Affiliations
Wei Zhou, Rudolph Technologies, Inc. (United States)
Max Guest, Rudolph Technologies, Inc. (United States)
Darcy Hart, Rudolph Technologies, Inc. (United States)


Published in SPIE Proceedings Vol. 8324:
Metrology, Inspection, and Process Control for Microlithography XXVI
Alexander Starikov, Editor(s)

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