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Proceedings Paper

Si nanowires arrays fabricated by wet chemical etching for antireflection and self-cleaning
Author(s): Wei Zhang; Xiaotao Wang; Wuxing Lai; Zirong Tang
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Paper Abstract

Here we report a simple and cost effective fabrication technique, which created large area vertical Si nanowires (diameter in ~200 nm) by means of silver induced wet chemical etching on single crystalline Si substrates. By this technique, Si nanowires were fabricated on single crystalline in aqueous 5M HF and 0.02M AgNO3 solution at room temperature. The scanning electron microscope (SEM) images indicate that etched silicon wafers consist of dense and nearly vertically aligned one-dimensional nanostructures. Length of Si nanowires was found to increase linearly with etching time (0-300 min). The mechanism of vertical nanowires formation can be understood as being a self-assembled Ag induced selective etching process based on the localized microscopic electrochemical cell model. A low reflectivity averaged ~1.7% from 450 to 790 nm was observed. The nanometer scale rough surface can make water droplet either in the so-called Wenzel or the Cassie regime, which can increase contact angle (CA). High CA makes the surface hydrophobicity and self-cleaning. Water CA (150°) was observed on the etched Si surface. Such antireflection (AR) and self-cleaning surface may have potential applications for silicon solar cells.

Paper Details

Date Published: 22 February 2012
PDF: 7 pages
Proc. SPIE 8333, Photonics and Optoelectronics Meetings (POEM) 2011: Optoelectronic Devices and Integration, 83331G (22 February 2012); doi: 10.1117/12.918269
Show Author Affiliations
Wei Zhang, Wuhan National Lab. for Optoelectronics (China)
Wuhan Univ. of Science and Technology (China)
Xiaotao Wang, Wuhan National Lab. for Optoelectronics (China)
Wuxing Lai, Wuhan National Lab. for Optoelectronics (China)
Zirong Tang, Wuhan National Lab. for Optoelectronics (China)


Published in SPIE Proceedings Vol. 8333:
Photonics and Optoelectronics Meetings (POEM) 2011: Optoelectronic Devices and Integration
Erich Kasper; Jinzhong Yu; Xun Li; Xinliang Zhang; Jinsong Xia; Junhao Chu; Zhijiang Dong; Bin Hu; Yan Shen, Editor(s)

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