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Proceedings Paper

Numerical simulation of temperature at drilling micro-hole on moving CO2 laser irradiated sticking plaster
Author(s): Zhiming Rao; Zhifang He; Jianqiang Du; Xinyou Zhang; Guoping Ai; Chunqiang Zhang; Tao Wu
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Paper Abstract

This paper applied numerical simulation of temperature by using finite element analysis software Ansys to study a model of drilling on sticking plaster. The continuous CO2 laser doing uniform linear motion and doing uniform circular motion irradiated sticking plaster to vaporize. The sticking plaster material was chosen as the thermal conductivity, the heat capacity and the density. For temperatures above 450 °C, sticking plaster would be vaporized. Based on the mathematical model of heat transfer, the process of drilling sticking plaster by laser beams could be simulated by Ansys. The simulation results showed the distribution of the temperature at the surface of the sticking plaster with the time of vaporizing at CO2 laser to do uniform linear motion and to do uniform circular motion. The temperature of sticking plaster CO2 laser to do uniform linear motion was higher than CO2 laser to do uniform circular motion in the same condition.

Paper Details

Date Published: 14 March 2012
PDF: 6 pages
Proc. SPIE 8330, Photonics and Optoelectronics Meetings (POEM) 2011: Laser and Terahertz Science and Technology, 83300M (14 March 2012); doi: 10.1117/12.918087
Show Author Affiliations
Zhiming Rao, Jiangxi Univ. of Traditional Chinese Medicine (China)
Huazhong Univ. of Science and Technology (China)
Zhifang He, Jiangxi Univ. of Traditional Chinese Medicine (China)
Jianqiang Du, Jiangxi Univ. of Traditional Chinese Medicine (China)
Xinyou Zhang, Jiangxi Univ. of Traditional Chinese Medicine (China)
Guoping Ai, Jiangxi Univ. of Traditional Chinese Medicine (China)
Chunqiang Zhang, Jiangxi Univ. of Traditional Chinese Medicine (China)
Tao Wu, Wuhan Institute of Technology (China)


Published in SPIE Proceedings Vol. 8330:
Photonics and Optoelectronics Meetings (POEM) 2011: Laser and Terahertz Science and Technology
Jianquan Yao; X. C. Zhang; Dapeng Yan; Jinsong Liu, Editor(s)

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