Share Email Print
cover

Proceedings Paper

E-beam inspection system for comparison of wafer and design data
Author(s): Oliver D. Patterson; Julie Lee; Michael D. Monkowski; Deborah A Ryan; Shih-tsung Chen; Shuen Cheng Lei; Fei Wang; Chung Han Lee; Derek Tomlinson; Wei Fang; Jack Jau
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Effectively patterning the intended design on the wafer for all possible geometries allowed by the design rule document is one of the most critical challenges for semiconductor manufacturing. Despite new lithography techniques like OPC, double patterning and the latest patterning simulation methods, and on-wafer evaluation using brightfield inspection and SEM review tools, patterning problems still occur and can result in a major delay in the qualification of a technology or product. Of particular concern are shorts and opens that cause product chip failure. Initial discovery of yield issues when a chip is being functionally tested is highly undesirable. A system for in-line, die to database (D2DB) comparison using E-beam inspection has been developed to address this risk. This system offers a substantial new line of defense against these patterning issues. The D2DB system is described along with a methodology for applying it for pattern fidelity inspection. Some examples illustrating the system operation are presented.

Paper Details

Date Published: 5 April 2012
PDF: 9 pages
Proc. SPIE 8324, Metrology, Inspection, and Process Control for Microlithography XXVI, 83242J (5 April 2012); doi: 10.1117/12.918072
Show Author Affiliations
Oliver D. Patterson, IBM Microelectronics (United States)
Julie Lee, IBM Microelectronics (United States)
Michael D. Monkowski, IBM Microelectronics (United States)
Deborah A Ryan, IBM Microelectronics (United States)
Shih-tsung Chen, Hermes-Microvision Inc. (United States)
Shuen Cheng Lei, Hermes-Microvision Inc. (United States)
Fei Wang, Hermes-Microvision Inc. (United States)
Chung Han Lee, Hermes-Microvision Inc. (United States)
Derek Tomlinson, Hermes-Microvision Inc. (United States)
Wei Fang, Hermes-Microvision Inc. (United States)
Jack Jau, Hermes-Microvision Inc. (United States)


Published in SPIE Proceedings Vol. 8324:
Metrology, Inspection, and Process Control for Microlithography XXVI
Alexander Starikov, Editor(s)

© SPIE. Terms of Use
Back to Top