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Proceedings Paper

A study of vertical lithography for high-density 3D structures
Author(s): Shin-Ichiro Hirai; Nobuyuki Saito; Yoshio Goto; Hiromi Suda; Ken-Ichiro Mori; Seiya Miura
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Paper Abstract

3D stacking technology using TSVs, as well as linewidth shrinking, is crucial for future progress in semiconductor devices. A new i-line exposure tool, the FPA-5510iV, has been developed which provides the functions necessary for implementing TSV processes. This paper reports on Canon's commitment to make advanced TSV processes a reality.

Paper Details

Date Published: 13 March 2012
PDF: 9 pages
Proc. SPIE 8326, Optical Microlithography XXV, 83261E (13 March 2012); doi: 10.1117/12.917877
Show Author Affiliations
Shin-Ichiro Hirai, Canon Inc. (Japan)
Nobuyuki Saito, Canon Inc. (Japan)
Yoshio Goto, Canon Inc. (Japan)
Hiromi Suda, Canon Inc. (Japan)
Ken-Ichiro Mori, Canon Inc. (Japan)
Seiya Miura, Canon Inc. (Japan)


Published in SPIE Proceedings Vol. 8326:
Optical Microlithography XXV
Will Conley, Editor(s)

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