Share Email Print

Proceedings Paper

Tradeoffs in mask architecture: dealing with future illumination angular diversity
Author(s): Brittany M. McClinton; Patrick P. Naulleau
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Extending EUV lithography to future nodes will lead to significant mask challenges. Higher-NA systems will come with larger angles of incidence on the mask, which further complicate the well-known shadowing problem. Addressing them may require the use of thinner absorbers. At the same time, however, the larger mean angle along with a larger diversity of illumination and diffraction angles can also lead to image and reflectivity degradation. Here we perform a modeling based study to explore the relative importance of these two effects for the 12- and 11-nm half pitch nodes. Specifically, we sacrifice reflectivity for increased angular bandwidth by reducing the number of layers in the multilayer stack to find solutions. We further explore thinner absorber and chirped multilayer designs in an attempt to mitigate these problems. As of the conclusion of this study, we have not been able to achieve any combination of parameters to meet the lithographic requirement of NILS 2.5 over 50nm defocus. We can also expect that any condition that meets this requirement will lead to throughput loss: in the most optimistic case we found reflectivity at 77º and 85º was reduced by 4%, though the lithographic requirement was not yet satisfied.

Paper Details

Date Published: 23 March 2012
PDF: 7 pages
Proc. SPIE 8322, Extreme Ultraviolet (EUV) Lithography III, 832220 (23 March 2012); doi: 10.1117/12.917788
Show Author Affiliations
Brittany M. McClinton, Univ. of California, Berkeley (United States)
Patrick P. Naulleau, Lawrence Berkeley National Lab. (United States)

Published in SPIE Proceedings Vol. 8322:
Extreme Ultraviolet (EUV) Lithography III
Patrick P. Naulleau; Obert R. Wood, Editor(s)

© SPIE. Terms of Use
Back to Top