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Proceedings Paper

Measurement of longitudinal strain and estimation of peel stress in adhesive-bonded single-lap joint of CFRP adherend using embedded FBG sensor
Author(s): X. Ning; H. Murayama; K. Kageyama; K. Uzawa; D. Wada
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Paper Abstract

In this research, longitudinal strain and peel stress in adhesive-bonded single-lap joint of carbon fiber reinforced plastics (CFRP) were measured and estimated by embedded fiber Bragg grating (FBG) sensor. Two unidirectional CFRP substrates were bonded by epoxy to form a single-lap configuration. The distributed strain measurement system is used. It is based on optical frequency domain reflectometry (OFDR), which can provide measurement at an arbitrary position along FBG sensors with the high spatial resolution. The longitudinal strain was measured based on Bragg grating effect and the peel stress was estimated based on birefringence effect. Special manufacturing procedure was developed to ensure the embedded location of FBG sensor. A portion of the FBG sensor was embedded into one of CFRP adherends along fiber direction and another portion was kept free for temperature compensation. Photomicrograph of cross-section of specimen was taken to verify the sensor was embedded into proper location after adherend curing. The residual strain was monitored during specimen curing and adhesive joint bonding process. Tensile tests were carried out and longitudinal strain and peel stress of the bondline are measured and estimated by the embedded FBG sensor. A two-dimensional geometrically nonlinear finite element analysis was performed by ANSYS to evaluate the measurement precision.

Paper Details

Date Published: 3 April 2012
PDF: 10 pages
Proc. SPIE 8345, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2012, 83451I (3 April 2012); doi: 10.1117/12.917431
Show Author Affiliations
X. Ning, The Univ. of Tokyo (Japan)
H. Murayama, The Univ. of Tokyo (Japan)
K. Kageyama, The Univ. of Tokyo (Japan)
K. Uzawa, The Univ. of Tokyo (Japan)
D. Wada, The Univ. of Tokyo (Japan)


Published in SPIE Proceedings Vol. 8345:
Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2012
Masayoshi Tomizuka; Chung-Bang Yun; Jerome P. Lynch, Editor(s)

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