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Proceedings Paper

Multiple-image-depth modeling for hotspot and AF printing detections
Author(s): Y. P. Tang; C. S. Chou; W. C. Huang; R. G. Liu; T. S. Gau
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Paper Abstract

Typical OPC models focus on predicting wafer contour or CD; therefore, the modeling approach emphasizes careful determination of feature and edge locations in the photo-resist (PR) as well as the exposure threshold, so that the 'cut' model image matches the wafer SEM contours or cut-line CDs most closely. This is an exquisite approach with regard to the contour-based OPC, for the model is calibrated directly from wafer CDs. However, for other applications such as hotspot detection or assist feature (AF) printing prediction that might occur at the top or the bottom of the PR, the typical OPC model approach may not be accurate enough. Usually, these kinds of phenomenon can only be properly described by rigorous simulation, which is very time-consuming and hence not suitable for OPC. In this paper, the approach of building the OPC model with multiple image depths will be discussed. This approach references the images at the bottom and/or the top of the PR. This way, the behavior of the images which are not shown at the normal image depth can be predicted more accurately without distorting the optical model. This compromised OPC modeling approach is beneficial for runtime reduction compared to the rigorous simulation, and for better accuracy compared to conventional model. The applications for AF printing and hotspot predictions using the multiple image depth approach will be demonstrated.

Paper Details

Date Published: 13 March 2012
PDF: 7 pages
Proc. SPIE 8326, Optical Microlithography XXV, 832619 (13 March 2012); doi: 10.1117/12.917402
Show Author Affiliations
Y. P. Tang, Taiwan Semiconductor Manufacturing Co. (Taiwan)
C. S. Chou, Taiwan Semiconductor Manufacturing Co. (Taiwan)
W. C. Huang, Taiwan Semiconductor Manufacturing Co. (Taiwan)
R. G. Liu, Taiwan Semiconductor Manufacturing Co. (Taiwan)
T. S. Gau, Taiwan Semiconductor Manufacturing Co. (Taiwan)


Published in SPIE Proceedings Vol. 8326:
Optical Microlithography XXV
Will Conley, Editor(s)

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