Share Email Print

Proceedings Paper

From performance validation to volume introduction of ASML's NXE platform
Author(s): Hans Meiling; Wim de Boeij; Frank Bornebroek; Noreen Harned; Ivo de Jong; Peter Kűrz; Martin Lowisch; Henk Meijer; David Ockwell; Rudy Peeters; Eelco van Setten; Judon Stoeldraijer; Christian Wagner; Stuart Young; Ron Kool
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

ASML's NXE platform is a multi-generation TWINSCAN™ platform using an exposure wavelength of 13.5nm, featuring a plasma source, all-reflective optics, and dual stages operating in vacuum. The NXE:3100 is the first product of this NXE platform. With a 0.25 NA projection optics, a planned throughput of 60 wafers/hr and dedicated chuck overlay of 4 nm, the NXE:3100 is targeted for extreme ultraviolet lithography (EUVL) implementation at 27nm halfpitch (hp) and below. The next generation NXE tools utilize a 0.33NA lens and include off-axis illumination for high volume manufacturing at a resolution down to 16nm hp and a targeted throughput of >100 wafers/hr. We share details of the performance of the 0.25NA lithography products in terms of imaging, overlay, throughput, and defectivity. We will show that we have met the required imaging performance associated with the 27nm hp node. We will also include a summary of the EUV source development, which is a key enabler for cost-effective introduction of EUVL into highvolume manufacturing. Finally, we will highlight some of the technical changes we introduced to enable the transition from 27 to 22nm lithographic performance while introducing our 0.33NA Step & Scan system, the NXE:3300B.

Paper Details

Date Published: 23 March 2012
PDF: 12 pages
Proc. SPIE 8322, Extreme Ultraviolet (EUV) Lithography III, 83221G (23 March 2012); doi: 10.1117/12.916971
Show Author Affiliations
Hans Meiling, ASML Netherlands B.V. (Netherlands)
Wim de Boeij, ASML Netherlands B.V. (Netherlands)
Frank Bornebroek, ASML Netherlands B.V. (Netherlands)
Noreen Harned, ASML Netherlands B.V. (Netherlands)
Ivo de Jong, ASML Netherlands B.V. (Netherlands)
Peter Kűrz, Carl Zeiss SMT GmbH (Germany)
Martin Lowisch, Carl Zeiss SMT GmbH (Germany)
Henk Meijer, ASML Netherlands B.V. (Netherlands)
David Ockwell, ASML Netherlands B.V. (Netherlands)
Rudy Peeters, ASML Netherlands B.V. (Netherlands)
Eelco van Setten, ASML Netherlands B.V. (Netherlands)
Judon Stoeldraijer, ASML Netherlands B.V. (Netherlands)
Christian Wagner, ASML Netherlands B.V. (Netherlands)
Stuart Young, ASML Netherlands B.V. (Netherlands)
Ron Kool, ASML Netherlands B.V. (Netherlands)

Published in SPIE Proceedings Vol. 8322:
Extreme Ultraviolet (EUV) Lithography III
Patrick P. Naulleau; Obert R. Wood, Editor(s)

© SPIE. Terms of Use
Back to Top