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Proceedings Paper

OPC model prediction capability improvements by accounting for mask 3D-EMF effects
Author(s): Jacky Cheng; Jessy Schramm; Dong Qing Zhang; Yee Mei Foong; Christian Zuniga; Thuy Do; Edita Tejnil; John Sturtevant; Angeline Chung; Kenneth Jantzen
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Paper Abstract

As mask feature sizes have shrunk well below the exposure wavelength, the thin mask of Kirchhoff approximation breaks down and 3D mask effects contribute significantly to the through-focus CD behavior of specific features. While full-chip rigorous 3D mask modeling is not computationally feasible, approximate simulation methods do enable the 3D mask effects to be represented. The use of such approximations improves model prediction capability. This paper will look at a 28nm darkfield and brightfield layer datasets that were calibrated with a Kirchhoff model and with two different 3D-EMF models. Both model calibration accuracy and verification fitness improvements are realized with the use of 3D models.

Paper Details

Date Published: 13 March 2012
PDF: 12 pages
Proc. SPIE 8326, Optical Microlithography XXV, 83261R (13 March 2012); doi: 10.1117/12.916863
Show Author Affiliations
Jacky Cheng, GLOBALFOUNDRIES (Singapore)
Jessy Schramm, GLOBALFOUNDRIES (Singapore)
Dong Qing Zhang, GLOBALFOUNDRIES (Singapore)
Yee Mei Foong, GLOBALFOUNDRIES (Singapore)
Christian Zuniga, Mentor Graphics Corp. (United States)
Thuy Do, Mentor Graphics Corp. (United States)
Edita Tejnil, Mentor Graphics Corp. (United States)
John Sturtevant, Mentor Graphics Corp. (United States)
Angeline Chung, Mentor Graphics Corp. (United States)
Kenneth Jantzen, Mentor Graphics Corp. (United States)

Published in SPIE Proceedings Vol. 8326:
Optical Microlithography XXV
Will Conley, Editor(s)

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