Share Email Print

Proceedings Paper

Key parameters of EUV resists for contact hole applications
Author(s): Kyoungyong Cho; Hiroki Nakagawa; Ken Maruyama; Makoto Shimizu; Tooru Kimura; Yoshi Hishiro
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Patterning contact hole (CH) features with good critical dimension uniformity (CDU) is one of the most critical challenges for 10nm node lithography and beyond. Extreme ultraviolet lithography (EUVL) is considered a potential candidate because of its better aerial imaging and larger k1 factor than ArF immersion. To apply EUV lithography to high volume manufacturing, EUV resists must overcome both the trade-off among resolution (R), local CD uniformity (LCDU), and sensitivity (S) at CH features and the RLS trade-off at line/space (LS) features. We evaluated various resist materials for CH patterning applications using the microexposure tools (METs) at SEMATECH in Albany, NY, and at Lawrence Berkeley National Laboratory. In this study, we report the correlation between the lithographic performance of EUV resist at CH features and physical properties of chemically amplified resists (CARs) such as their dissolution behavior, the activation energy level of the protective group, and the acidity/acid diffusion length of the photoacid generator (PAG).

Paper Details

Date Published: 23 March 2012
PDF: 9 pages
Proc. SPIE 8322, Extreme Ultraviolet (EUV) Lithography III, 83221B (23 March 2012); doi: 10.1117/12.916837
Show Author Affiliations
Kyoungyong Cho, SEMATECH North (United States)
Hiroki Nakagawa, JSR Micro, Inc. (United States)
Ken Maruyama, JSR Micro, Inc. (United States)
Makoto Shimizu, JSR Corp. (Japan)
Tooru Kimura, JSR Corp. (Japan)
Yoshi Hishiro, JSR Micro, Inc. (United States)

Published in SPIE Proceedings Vol. 8322:
Extreme Ultraviolet (EUV) Lithography III
Patrick P. Naulleau; Obert R. Wood, Editor(s)

© SPIE. Terms of Use
Back to Top