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Proceedings Paper

Planarization coating for polyimide substrates used in roll-to-roll fabrication of active matrix backplanes for flexible displays
Author(s): A. Marcia Almanza-Workman; Albert Jeans; Steve Braymen; Richard E. Elder; Robert A. Garcia; Alejandro de la Fuente Vornbrock; Jason Hauschildt; Edward Holland; Warren Jackson; Mehrban Jam; Frank Jeffrey; Kelly Junge; Han-Jun Kim; Ohseung Kwon; Don Larson; Hao Luo; John Maltabes; Ping Mei; Craig Perlov; Mark Smith; Dan Stieler; Carl P. Taussig; Steve Trovinger; Lihua Zhao
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Paper Abstract

Good surface quality of plastic substrates is essential to reduce pixel defects during roll-to-roll fabrication of flexible display active matrix backplanes. Standard polyimide substrates have a high density of "bumps" from fillers and belt marks and other defects from dust and surface scratching. Some of these defects could be the source of shunts in dielectrics. The gate dielectric must prevent shorts between the source/drain and the gate in the transistors, resist shorts in the hold capacitor and stop shorts in the data/gate line crossovers in active matrix backplanes fabricated by self-aligned imprint lithography (SAIL) roll-to-roll processes. Otherwise data and gate lines will become shorted creating line or pixel defects. In this paper, we discuss the development of a proprietary UV curable planarization material that can be coated by roll-to-roll processes. This material was engineered to have low shrinkage, excellent adhesion to polyimide, high dry etch resistance, and great chemical and thermal stability. Results from PECVD deposition of an amorphous silicon stack on the planarized polyimide and compatibility with roll-to-roll processes to fabricate active matrix backplanes are also discussed. The effect of the planarization on defects in the stack, shunts in the dielectric and curvature of finished arrays will also be described.

Paper Details

Date Published: 21 March 2012
PDF: 11 pages
Proc. SPIE 8323, Alternative Lithographic Technologies IV, 83231K (21 March 2012); doi: 10.1117/12.916748
Show Author Affiliations
A. Marcia Almanza-Workman, Phicot, Inc. (United States)
Albert Jeans, Hewlett-Packard Labs. (United States)
Steve Braymen, Powerfilm, Inc. (United States)
Richard E. Elder, Hewlett-Packard Labs. (United States)
Robert A. Garcia, Hewlett-Packard Labs. (United States)
Alejandro de la Fuente Vornbrock, Hewlett-Packard Labs. (United States)
Jason Hauschildt, PowerFilm, Inc. (United States)
Edward Holland, Hewlett-Packard Labs. (United States)
Warren Jackson, Hewlett-Packard Labs. (United States)
Mehrban Jam, Hewlett-Packard Labs. (United States)
Frank Jeffrey, Powerfilm, Inc. (United States)
Kelly Junge, Powerfilm, Inc. (United States)
Han-Jun Kim, Hewlett-Packard Labs. (United States)
Ohseung Kwon, Phicot, Inc. (United States)
Don Larson, Powerfilm, Inc. (United States)
Hao Luo, Hewlett-Packard Labs. (United States)
John Maltabes, Hewlett-Packard Labs. (United States)
Ping Mei, Hewlett-Packard Labs. (United States)
Craig Perlov, Hewlett-Packard Labs. (United States)
Mark Smith, Hewlett-Packard Labs. (United States)
Dan Stieler, Powerfilm, Inc. (United States)
Carl P. Taussig, Hewlett-Packard Labs. (United States)
Steve Trovinger, Hewlett-Packard Labs. (United States)
Lihua Zhao, Hewlett-Packard Labs. (United States)


Published in SPIE Proceedings Vol. 8323:
Alternative Lithographic Technologies IV
William M. Tong, Editor(s)

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