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Proceedings Paper

The influence of bonding process of optical pickup head's manufacture and the corresponding solution
Author(s): Bangquan Liao; Yimo Zhang
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Paper Abstract

Optical pickup head is composed by many optical elements, and the relative position of the optical elements should be adjusted precisely and be bonded carefully. Different bonding process may lead to different influence of the optical pickup head's function; worse bonding process even may destroy the optical pickup head. In order to ensure the product quality of optical pickup head we develop one kind of method to study the influence of bonding process and introduce one kind of solution. We use 24 pieces of optical pickup heads to measure the objective lens' focus voltage and analyze the statistical distribution. After 2 hours' saving under 70°C and 2 hours' saving under normal temperature we measure the objective lens' focus voltage and analyze the statistical distribution again. Through comparing the above two groups' data we can know the variation after 2 hours' saving under 70°C and 2 hours' saving under normal temperature. Through changing the primary position of the objective lens and measuring and comparing again and again we can control all optical pickup heads' objective lens' position in the range we wanted. Once we find objective lens' ideal primary position and bonding process we can fix these conditions and apply them to manufacture. It suggests that such kind of method is useful and necessary for optical pickup head's industrial production.

Paper Details

Date Published: 30 November 2011
PDF: 10 pages
Proc. SPIE 8201, 2011 International Conference on Optical Instruments and Technology: Optoelectronic Measurement Technology and Systems, 82010Q (30 November 2011); doi: 10.1117/12.916691
Show Author Affiliations
Bangquan Liao, Tianjin Univ. (China)
Yimo Zhang, Tianjin Univ. (China)


Published in SPIE Proceedings Vol. 8201:
2011 International Conference on Optical Instruments and Technology: Optoelectronic Measurement Technology and Systems
Xinyong Dong; Xiaoyi Bao; Perry Ping Shum; Tiegen Liu, Editor(s)

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