Share Email Print
cover

Proceedings Paper

Advanced mask aligner lithography (AMALITH)
Author(s): Reinhard Voelkel; Uwe Vogler; Arianna Bramati; Tina Weichelt; Lorenz Stuerzebecher; Uwe D. Zeitner; Kristian Motzek; Andreas Erdmann; Michael Hornung; Ralph Zoberbier
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Mask aligners were the dominating lithography tool for the first 20 years of semiconductor industry. In the 1980s industry changed over to projection lithography. However, mask aligners were never sorted out and still today hundreds of new mask aligners are sold each year. This continuing success of mask aligner lithography is due to two basic trends in lithography: (a) Costs for leading-edge lithography tools double approximately every 4.4 years; and (b) the number of lithography steps per wafer was increasing from a few litho layers to more than 35 layers now. This explains why mask aligners, a very cost-effective solution for uncritical litho layers, are still widely used today. In over 50 years of semiconductor industry the mask aligner system has changed tremendously. However, only little effort was undertaken to improve the shadow printing process itself. We now present a new illumination system for mask aligners, the MO Exposure Optics (MOEO), which is based on two microlens-type Köhler integrators located in Fourier-conjugated planes. The optics stabilizes the illumination against misalignment of the lamp-to-ellipsoid position. It provides improved light uniformity, telecentric illumination and allows freely shaping the angular spectrum of the illumination light by spatial filtering. It significantly improves the CD uniformity, the yield in production and opens the door to a new era of Advanced Mask Aligner Lithography (AMALITH), where customized illumination, optical proximity correction (OPC), Talbot-lithography, phase shift masks (AAPSM) and source mask optimization (SMO) are introduced to mask aligner lithography.

Paper Details

Date Published: 13 March 2012
PDF: 12 pages
Proc. SPIE 8326, Optical Microlithography XXV, 83261Y (13 March 2012); doi: 10.1117/12.916509
Show Author Affiliations
Reinhard Voelkel, SUSS MicroOptics SA (Switzerland)
Uwe Vogler, SUSS MicroOptics SA (Switzerland)
Arianna Bramati, SUSS MicroOptics SA (Switzerland)
Tina Weichelt, SUSS MicroOptics SA (Switzerland)
Lorenz Stuerzebecher, Fraunhofer-Institut für Angewandte Optik und Feinmechanik (Germany)
Uwe D. Zeitner, Fraunhofer-Institut für Angewandte Optik und Feinmechanik (Germany)
Kristian Motzek, Fraunhofer Institute for Integrated Systems and Device Technology (Germany)
Andreas Erdmann, Fraunhofer Institute for Integrated Systems and Device Technology (Germany)
Michael Hornung, SUSS MicroTec Lithography GmbH (Germany)
Ralph Zoberbier, SUSS MicroTec Lithography GmbH (Germany)


Published in SPIE Proceedings Vol. 8326:
Optical Microlithography XXV
Will Conley, Editor(s)

© SPIE. Terms of Use
Back to Top