Share Email Print
cover

Proceedings Paper

Overlay control methodology comparison: field-by-field and high-order methods
Author(s): Chun-Yen Huang; Chui-Fu Chiu; Wen-Bin Wu; Chiang-Lin Shih; Chin-Chou Kevin Huang; Healthy Huang; DongSub Choi; Bill Pierson; John C. Robinson
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Overlay control in advanced integrated circuit (IC) manufacturing is becoming one of the leading lithographic challenges in the 3x and 2x nm process nodes. Production overlay control can no longer meet the stringent emerging requirements based on linear composite wafer and field models with sampling of 10 to 20 fields and 4 to 5 sites per field, which was the industry standard for many years. Methods that have emerged include overlay metrology in many or all fields, including the high order field model method called high order control (HOC), and field by field control (FxFc) methods also called correction per exposure. The HOC and FxFc methods were initially introduced as relatively infrequent scanner qualification activities meant to supplement linear production schemes. More recently, however, it is clear that production control is also requiring intense sampling, similar high order and FxFc methods. The added control benefits of high order and FxFc overlay methods need to be balanced with the increased metrology requirements, however, without putting material at risk. Of critical importance is the proper control of edge fields, which requires intensive sampling in order to minimize signatures. In this study we compare various methods of overlay control including the performance levels that can be achieved.

Paper Details

Date Published: 5 April 2012
PDF: 9 pages
Proc. SPIE 8324, Metrology, Inspection, and Process Control for Microlithography XXVI, 832427 (5 April 2012); doi: 10.1117/12.916427
Show Author Affiliations
Chun-Yen Huang, Nanya Technology Corp. (Taiwan)
Chui-Fu Chiu, Nanya Technology Corp. (Taiwan)
Wen-Bin Wu, Nanya Technology Corp. (Taiwan)
Chiang-Lin Shih, Nanya Technology Corp. (Taiwan)
Chin-Chou Kevin Huang, KLA-Tencor Corp. (United States)
Healthy Huang, KLA-Tencor Corp. (Taiwan)
DongSub Choi, KLA-Tencor Corp. (Korea, Republic of)
Bill Pierson, KLA-Tencor Corp. (United States)
John C. Robinson, KLA-Tencor Corp. (United States)


Published in SPIE Proceedings Vol. 8324:
Metrology, Inspection, and Process Control for Microlithography XXVI
Alexander Starikov, Editor(s)

© SPIE. Terms of Use
Back to Top