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Proceedings Paper

Contamination control: removing small particles from increasingly large wafers
Author(s): A. J. de Jong; J. C. J. van der Donck; T. Huijser; O. Kievit; R. Koops; N. B. Koster; F. T. Molkenboer; A. M. M. G. Theulings
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Paper Abstract

With the introduction of 450 mm wafers, which are considerably larger than the currently largest wafers of 300mm, handling with side grippers is no longer possible and backside grippers are required. Backside gripping increases the possible buildup of particles on the backside of the wafers with possible cross-contamination to the front-side. Therefore, regular backside cleaning is required. Three vacuum compatible cleaning methods were selected. Tacky rollers and highvoltage cleaning were selected for particles and plasma cleaning for molecular layers. A test-bench was designed and constructed implementing these three cleaning methods. The first experiments show promising results for the plasma cleaner and the tacky roller.

Paper Details

Date Published: 3 April 2012
PDF: 12 pages
Proc. SPIE 8324, Metrology, Inspection, and Process Control for Microlithography XXVI, 832423 (3 April 2012); doi: 10.1117/12.916366
Show Author Affiliations
A. J. de Jong, TNO Delft (Netherlands)
J. C. J. van der Donck, TNO Delft (Netherlands)
T. Huijser, TNO Delft (Netherlands)
O. Kievit, TNO Delft (Netherlands)
R. Koops, Delft Univ. of Technology (Netherlands)
N. B. Koster, Delft Univ. of Technology (Netherlands)
F. T. Molkenboer, Delft Univ. of Technology (Netherlands)
A. M. M. G. Theulings, Delft Univ. of Technology (Netherlands)


Published in SPIE Proceedings Vol. 8324:
Metrology, Inspection, and Process Control for Microlithography XXVI
Alexander Starikov, Editor(s)

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