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Proceedings Paper

Reticle intensity-based critical dimension uniformity to improve efficiency for DOMA correction in a foundry
Author(s): Kin Wai Tang; Teng Hwee Ng; Lei Huang; Susan Ng; Thomas Ku; Wee Teck Chia; Lin Chua; William Li; Aaron Chin; Aditya Dayal; Tom Vavul; Trent Hutchinson
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Paper Abstract

As transistor dimensions shrinks, the requirement for wafer critical dimensions control is becoming increasingly challenging. The intra-field critical dimension uniformity (CDU) of the features on the reticle is one of the many sources of wafer CD variation. In this paper, we study how the CDU on the reticle can be obtained by using the intensity information collected during reticle inspection (iCDUTM) on the KLA-Tencor TeraScan reticle inspection tool. The collected CDU information of the reticle is then applied as an intra-field dose correction function to improve wafer intra-field CD uniformity. Using this method of extracting the reticle CDU from the intensity information allows for simple integration into a high-volume production environment and an improved capability for intra-field CDU correction without the need to expose any wafers for CD measurement nor any GDS design information. The ability to apply iCDU on prototype devices on first pass run can also accelerate device development.

Paper Details

Date Published: 5 April 2012
PDF: 8 pages
Proc. SPIE 8324, Metrology, Inspection, and Process Control for Microlithography XXVI, 83242W (5 April 2012); doi: 10.1117/12.916335
Show Author Affiliations
Kin Wai Tang, GLOBALFOUNDRIES Singapore (Singapore)
Teng Hwee Ng, GLOBALFOUNDRIES Singapore (Singapore)
Lei Huang, GLOBALFOUNDRIES Singapore (Singapore)
Susan Ng, GLOBALFOUNDRIES Singapore (Singapore)
Thomas Ku, GLOBALFOUNDRIES Singapore (Singapore)
Wee Teck Chia, KLA-Tencor Singapore (Singapore)
Lin Chua, KLA-Tencor Singapore (Singapore)
William Li, KLA-Tencor Singapore (Singapore)
Aaron Chin, KLA-Tencor Singapore (Singapore)
Aditya Dayal, KLA-Tencor Corp. (United States)
Tom Vavul, KLA-Tencor Corp. (United States)
Trent Hutchinson, KLA-Tencor Corp. (United States)


Published in SPIE Proceedings Vol. 8324:
Metrology, Inspection, and Process Control for Microlithography XXVI
Alexander Starikov, Editor(s)

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