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Proceedings Paper

Controlling template erosion with advanced cleaning methods
Author(s): SherJang Singh; Zhaoning Yu; Tobias Wähler; Nobuo Kurataka; Gene Gauzner; Hongying Wang; Henry Yang; Yautzong Hsu; Kim Lee; David Kuo; Peter Dress
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Paper Abstract

We studied the erosion and feature stability of fused silica patterns under different template cleaning conditions. The conventional SPM cleaning is compared with an advanced non-acid process. Spectroscopic ellipsometry optical critical dimension (SE-OCD) measurements were used to characterize the changes in pattern profile with good sensitivity. This study confirmed the erosion of the silica patterns in the traditional acid-based SPM cleaning mixture (H2SO4+H2O2) at a rate of ~0.1nm per cleaning cycle. The advanced non-acid clean process however only showed CD shift of ~0.01nm per clean. Contamination removal & pattern integrity of sensitive 20nm features under MegaSonic assisted cleaning is also demonstrated.

Paper Details

Date Published: 21 March 2012
PDF: 6 pages
Proc. SPIE 8323, Alternative Lithographic Technologies IV, 832317 (21 March 2012); doi: 10.1117/12.916294
Show Author Affiliations
SherJang Singh, SUSS MicroTec Inc. (United States)
Zhaoning Yu, Seagate Technology LLC (United States)
Tobias Wähler, HamaTech APE GmbH & Co. KG (Germany)
Nobuo Kurataka, Seagate Technology LLC (United States)
Gene Gauzner, Seagate Technology LLC (United States)
Hongying Wang, Seagate Technology LLC (United States)
Henry Yang, Seagate Technology LLC (United States)
Yautzong Hsu, Seagate Technology LLC (United States)
Kim Lee, Seagate Technology LLC (United States)
David Kuo, Seagate Technology LLC (United States)
Peter Dress, HamaTech APE GmbH & Co. KG (Germany)


Published in SPIE Proceedings Vol. 8323:
Alternative Lithographic Technologies IV
William M. Tong, Editor(s)

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