Share Email Print
cover

Proceedings Paper

Tunable resin reactivity of spin-on dielectric by controlling synthesis process
Author(s): Kwen Woo Han; Hyun-Ji Song; Mi-Young Kim; Eun Su Park; Hui Chan Yoon; Go Eun Kim; Sang Hak Lim; Sang Kyun Kim
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

In the recent semiconductor industry, as the device shrinks, spin-on dielectric (SOD) has been adopted as a widely used material because of its excellent gap-fill, efficient throughput on mass production and highly competitive initial cost of ownership. Among various semiconductor applications, SOD is especially valued as the suitable gap-fill material for shallow trench isolation (STI), because the previously adopted technology, high density plasma chemical vapor deposition (HDP-CVD), has a significant problem with void-free gap-fill on patterns with high aspect ratios. As SOD is spin-coated on those narrow patterns, planarization is one of the important requirements. On the course of our efforts on developing novel modified SOD materials, we discovered that the reactivity of each SOD resins has meaningful correlation with the degree of planarization. In this paper, three experiments have been illustrated to prove this correlation, 1) step coverage test, 2) humid air bubble test, and 3) film thickness shrinkage upon prebake. The SOD resin with lower reactivity turned out to exhibit 1) larger size of circle around silica-beads, 2) slower molecular weight growth under humid bubble condition, and 3) higher shrinkage upon prebake.

Paper Details

Date Published: 20 March 2012
PDF: 7 pages
Proc. SPIE 8325, Advances in Resist Materials and Processing Technology XXIX, 83252B (20 March 2012); doi: 10.1117/12.916252
Show Author Affiliations
Kwen Woo Han, Samsung Cheil Industries Inc. (Korea, Republic of)
Hyun-Ji Song, Samsung Cheil Industries Inc. (Korea, Republic of)
Mi-Young Kim, Samsung Cheil Industries Inc. (Korea, Republic of)
Eun Su Park, Samsung Cheil Industries Inc. (Korea, Republic of)
Hui Chan Yoon, Samsung Cheil Industries Inc. (Korea, Republic of)
Go Eun Kim, Samsung Cheil Industries Inc. (Korea, Republic of)
Sang Hak Lim, Samsung Cheil Industries Inc. (Korea, Republic of)
Sang Kyun Kim, Samsung Cheil Industries Inc. (Korea, Republic of)


Published in SPIE Proceedings Vol. 8325:
Advances in Resist Materials and Processing Technology XXIX
Mark H. Somervell; Thomas I. Wallow, Editor(s)

© SPIE. Terms of Use
Back to Top