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Proceedings Paper

Resist process optimization for further defect reduction
Author(s): Keiichi Tanaka; Tomohiro Iseki; Hiroshi Marumoto; Koji Takayanagi; Yuichi Yoshida; Ryouichi Uemura; Kosuke Yoshihara
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Paper Abstract

Defect reduction has become one of the most important technical challenges in device mass-production. Knowing that resist processing on a clean track strongly impacts defect formation in many cases, we have been trying to improve the track process to enhance customer yield. For example, residual type defect and pattern collapse are strongly related to process parameters in developer, and we have reported new develop and rinse methods in the previous papers. Also, we have reported the optimization method of filtration condition to reduce bridge type defects, which are mainly caused by foreign substances such as gels in resist. Even though we have contributed resist caused defect reduction in past studies, defect reduction requirements continue to be very important. In this paper, we will introduce further process improvements in terms of resist defect reduction, including the latest experimental data.

Paper Details

Date Published: 20 March 2012
PDF: 10 pages
Proc. SPIE 8325, Advances in Resist Materials and Processing Technology XXIX, 83252L (20 March 2012); doi: 10.1117/12.915813
Show Author Affiliations
Keiichi Tanaka, Tokyo Electron Kyushu Ltd. (Japan)
Tomohiro Iseki, Tokyo Electron Kyushu Ltd. (Japan)
Hiroshi Marumoto, Tokyo Electron Kyushu Ltd. (Japan)
Koji Takayanagi, Tokyo Electron Kyushu Ltd. (Japan)
Yuichi Yoshida, Tokyo Electron Kyushu Ltd. (Japan)
Ryouichi Uemura, Tokyo Electron Kyushu Ltd. (Japan)
Kosuke Yoshihara, Tokyo Electron Kyushu Ltd. (Japan)


Published in SPIE Proceedings Vol. 8325:
Advances in Resist Materials and Processing Technology XXIX
Mark H. Somervell; Thomas I. Wallow, Editor(s)

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