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Proceedings Paper

Investigation of pattern wiggling for spin-on organic hardmask materials
Author(s): Goji Wakamatsu; Kentaro Goto; Yoshi Hishiro; Taiichi Furukawa; Satoru Murakami; Masayuki Motonari; Yoshikazu Yamaguchi; Tsutomu Shimokawa; Greg Breyta; Anuja DeSilva; Noel Arellano; Luisa D. Bozano; Carl E. Larson; Martin Glodde; Ratnam Sooriyakumaran
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Paper Abstract

Semiconductor manufacturing technology is currently undergoing a transformation from immersion photolithography to double patterning or EUV technology. The resultant resist dimensional size and height shrinks will require improved pattern transfer techniques and materials. Underlayer (UL) processes which include chemical vapor deposition (CVD) and spin-on application play a very important role in various chip manufacturing integration schemes. A pattern wiggling problem during substrate etch has arisen as a critical issue when pattern dimensions shrink. CVD processes have shown better pattern transfer performance than spin-on processes but at higher cost and process complexity along with difficulty in obtaining planarization and good gap fill. Thus spin-on process development has received increased attention recently as an attractive alternative to CVD processing. In this work we focus on elucidating the mechanism of UL wiggling and have synthesized materials that address several hypothesized mechanisms of failure: hydrogen content, modulus, film density, charge control unit type and thermal resistance. UL materials with high thermal resistance additionally provide the ability to expand the applicability of spin-on approaches. Material properties and wiggle failure test results will be discussed.

Paper Details

Date Published: 20 March 2012
PDF: 9 pages
Proc. SPIE 8325, Advances in Resist Materials and Processing Technology XXIX, 83250T (20 March 2012); doi: 10.1117/12.915698
Show Author Affiliations
Goji Wakamatsu, JSR Micro, Inc. (United States)
Kentaro Goto, JSR Micro, Inc. (United States)
Yoshi Hishiro, JSR Micro, Inc. (United States)
Taiichi Furukawa, JSR Corp. (Japan)
Satoru Murakami, JSR Corp. (Japan)
Masayuki Motonari, JSR Corp. (Japan)
Yoshikazu Yamaguchi, JSR Corp. (Japan)
Tsutomu Shimokawa, JSR Corp. (Japan)
Greg Breyta, IBM Almaden Research Ctr. (United States)
Anuja DeSilva, IBM Almaden Research Ctr. (United States)
Noel Arellano, IBM Almaden Research Ctr. (United States)
Luisa D. Bozano, IBM Almaden Research Ctr. (United States)
Carl E. Larson, IBM Almaden Research Ctr. (United States)
Martin Glodde, IBM Thomas J. Watson Research Ctr. (United States)
Ratnam Sooriyakumaran, IBM Almaden Research Ctr. (United States)


Published in SPIE Proceedings Vol. 8325:
Advances in Resist Materials and Processing Technology XXIX
Mark H. Somervell; Thomas I. Wallow, Editor(s)

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