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Proceedings Paper

Haptics using a smart material for eyes free interaction in mobile devices
Author(s): Huihui Wang; Dimosthenis Kaleas; Roger Ruuspakka; Robert Tartz
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Paper Abstract

We present a proof of concept (POC) for haptic interaction when audio or visual feedback is not practical. The POC includes addressable arrays of two-way Shape Memory Alloy (SMA) springs which can operate at a lower voltage and temperature compatible with mobile devices. They will form different shapes due to the thermal effect as current travels through the springs. The POC can simultaneously realize multiple methods for conveying haptic information such as dimension, force, texture and temperature due to the flexible array design. The haptic interface can go back to the original shape by itself after the current is off due to the advance of two way SMA. We are developing applications with different POC designs for tangible interactions.

Paper Details

Date Published: 28 March 2012
PDF: 8 pages
Proc. SPIE 8341, Active and Passive Smart Structures and Integrated Systems 2012, 83410I (28 March 2012); doi: 10.1117/12.915403
Show Author Affiliations
Huihui Wang, Qualcomm Inc. (United States)
Dimosthenis Kaleas, Qualcomm Inc. (United States)
Roger Ruuspakka, Qualcomm Inc. (United States)
Robert Tartz, Qualcomm Inc. (United States)


Published in SPIE Proceedings Vol. 8341:
Active and Passive Smart Structures and Integrated Systems 2012
Henry A. Sodano, Editor(s)

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