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Proceedings Paper

An experimental study on disbond detection in a thermal insulation system using guided waves under a load-temperature environment
Author(s): Yishou Wang; Shuyi Ma; Zhanjun Wu; Kehai Liu; Xinlin Qing
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Paper Abstract

The integrity monitoring of foam based thermal insulation systems is investigated under a load-temperature environment. Guided wave propagation studies are conducted on two specimens using the pitch-catch approach. To receive only the guided wave, the interval distance is 15mm and 20 mm between two adjacent sensors for specimens. The appropriate guided wave modes are generated by changing the excitation signal. To simulate the thermal and load environment of the thermal insulation system, the test piece is assembled on the load-temperature test machine, where the compression load gradually up to 3 tons is applied to the test piece along its axial direction. Different temperatures are applied to two sides of the test piece. The side without the foam is cooled using Liquid nitrogen to -196°C, while the other side with the foam is heated by the thermocouple to 120 °C. The guided wave signals are obtained before/after the experiment begins/ends, and also received periodically in the joint work process of the pressure and the different temperatures. Signals processing and damage imaging techniques are combined to demonstrate the possible disbond defect. Experimental results show that the disbond defect between the foam and the substrate can be qualitatively detected, and its expansion could be identified.

Paper Details

Date Published: 20 April 2012
PDF: 9 pages
Proc. SPIE 8348, Health Monitoring of Structural and Biological Systems 2012, 834812 (20 April 2012); doi: 10.1117/12.914962
Show Author Affiliations
Yishou Wang, Dalian Univ. of Technology (China)
Commercial Aircraft Corp. of China, Ltd. (China)
Shuyi Ma, Dalian Univ. of Technology (China)
Zhanjun Wu, Dalian Univ. of Technology (China)
Kehai Liu, Dalian Univ. of Technology (China)
Xinlin Qing, Commercial Aircraft Corp. of China, Ltd. (China)


Published in SPIE Proceedings Vol. 8348:
Health Monitoring of Structural and Biological Systems 2012
Tribikram Kundu, Editor(s)

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