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Proceedings Paper

Thermal effects on a passive wireless antenna sensor for strain and crack sensing
Author(s): Xiaohua Yi; Rushi Vyas; Chunhee Cho; Chia-Hung Fang; James Cooper; Yang Wang; Roberto T. Leon; Manos M. Tentzeris
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Paper Abstract

For application in structural health monitoring, a folded patch antenna has been previously designed as a wireless sensor that monitors strain and crack in metallic structures. Resonance frequency of the RFID patch antenna is closely related with its dimension. To measure stress concentration in a base structure, the sensor is bonded to the structure like a traditional strain gage. When the antenna sensor is under strain/deformation together with the base structure, the antenna resonance frequency varies accordingly. The strain-related resonance frequency variation is wirelessly interrogated and recorded by a reader, and can be used to derive strain/deformation. Material properties of the antenna components can have significant effects on sensor performance. This paper investigates thermal effects through both numerical simulation and temperature chamber testing. When temperature fluctuates, previous sensor design (with a glass microfiber-reinforced PTFE substrate) shows relatively large variation in resonance frequency. To improve sensor performance, a new ceramic-filled PTFE substrate material is chosen for re-designing the antenna sensor. Temperature chamber experiments are also conducted to the sensor with new substrate material, and compared with previous design.

Paper Details

Date Published: 3 April 2012
PDF: 11 pages
Proc. SPIE 8345, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2012, 83450F (3 April 2012); doi: 10.1117/12.914833
Show Author Affiliations
Xiaohua Yi, Georgia Institute of Technology (United States)
Rushi Vyas, Georgia Institute of Technology (United States)
Chunhee Cho, Georgia Institute of Technology (United States)
Chia-Hung Fang, Georgia Institute of Technology (United States)
James Cooper, Georgia Institute of Technology (United States)
Yang Wang, Georgia Institute of Technology (United States)
Roberto T. Leon, Virginia Polytechnic Institute and State Univ. (United States)
Manos M. Tentzeris, Georgia Institute of Technology (United States)


Published in SPIE Proceedings Vol. 8345:
Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2012
Masayoshi Tomizuka; Chung-Bang Yun; Jerome P. Lynch, Editor(s)

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