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Proceedings Paper

Concept and design of a fiber-optic and an I2C hybrid sensor bus system for telecommunication satellites
Author(s): P. Putzer; A. Hurni; M. Manhart; C. Tiefenbeck; M. Plattner; A. W. Koch
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Paper Abstract

In this paper the concept and design of the Hybrid Sensor Bus (HSB) system for telecommunication satellites is presented. The HSB development in the frame of an ESA-ARTES project has been started in 2011 and the system will be tested as flight demonstrator onboard the German Heinrich Hertz communication satellite (H2Sat) in 2016. In state-of-the-art telecommunication platforms hundreds of sensors are necessary for satellite control and monitoring. The sensors are wired point-to-point (p2p) to the satellite management unit (SMU) which results in a high mass impact but preliminary increases AIT effort and thereby the overall satellite costs. Sensor bus architectures reduce AIT cost by reduction of wiring effort, reduction in required test time and by providing a flexible sensor network topology. The HSB system is based on a modular concept including a controller module, a fiber-optic interrogator module and an I²C electric interrogator module The HSB system provides advanced performance which includes programmable and sensor specific alarm functions, averaging of dedicated sensor values and thereby a reduction of SMU processor load. The combination of electrical I2C sensors for punctual resolved measurements and fiber-optic sensors for e.g. thermal mapping of panels by embedding sensor fibers in the satellite structures results in a versatile system. In this paper we present the design of the HSB system taking into account the requirements from European platform manufacturers. The HSB design yields a product which can be implemented as replacement of standard p2p systems to build up a more cost efficient sensor system for geostationary satellites.

Paper Details

Date Published: 6 April 2012
PDF: 7 pages
Proc. SPIE 8345, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2012, 83453L (6 April 2012); doi: 10.1117/12.914787
Show Author Affiliations
P. Putzer, Technische Univ. München (Germany)
A. Hurni, Kayser-Threde GmbH (Germany)
M. Manhart, Kayser-Threde GmbH (Germany)
C. Tiefenbeck, Kayser-Threde GmbH (Germany)
M. Plattner, Kayser-Threde GmbH (Germany)
A. W. Koch, Technische Univ. München (Germany)

Published in SPIE Proceedings Vol. 8345:
Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2012
Masayoshi Tomizuka; Chung-Bang Yun; Jerome P. Lynch, Editor(s)

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