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Proceedings Paper

Low f-number microlens array fabricated in thick resist
Author(s): Giuseppe A. Cirino; Arlindo N. Montagnoli; Patrick Verdonck; Luiz G. Neto
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Paper Abstract

In certain applications of MOEMS devices, it is often necessary to produce microlens array structures that concentrate optical power in semiconductor photodetectors. In this work, the design and fabrication of a low f-number cylindrical microlens array is presented. The lenses were fabricated in thick photo resist - 12 μm thick - using a contact printer exposure through a mask with a repetitive 6 μm line - 4 μm space pattern. The width of the resulting microlens array was determined to be 10 μm, with f-number of 0.5. Numerical calculations based on scalar diffraction theory were employed to model the light propagation inside the resist, determining the aerial image as a function of its thickness. Than the resist response characteristics, expressed by its contrast curve, and absorption rate were used to obtain a cross section profile. A good match between numerical and experimental results were found.

Paper Details

Date Published: 8 May 2012
PDF: 9 pages
Proc. SPIE 8428, Micro-Optics 2012, 842819 (8 May 2012); doi: 10.1117/12.914417
Show Author Affiliations
Giuseppe A. Cirino, Univ. Federal de São Carlos (Brazil)
Arlindo N. Montagnoli, Univ. Federal de São Carlos (Brazil)
Patrick Verdonck, IMEC (Belgium)
Luiz G. Neto, Univ. de São Paulo (Brazil)


Published in SPIE Proceedings Vol. 8428:
Micro-Optics 2012
Hugo Thienpont; Jürgen Mohr; Hans Zappe; Hirochika Nakajima, Editor(s)

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