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Proceedings Paper

Applications of picosecond lasers and pulse-bursts in precision manufacturing
Author(s): Ralf Knappe
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Paper Abstract

Just as CW and quasi-CW lasers have revolutionized the materials processing world, picosecond lasers are poised to change the world of micromachining, where lasers outperform mechanical tools due to their flexibility, reliability, reproducibility, ease of programming, and lack of mechanical force or contamination to the part. Picosecond lasers are established as powerful tools for micromachining. Industrial processes like micro drilling, surface structuring and thin film ablation benefit from a process, which provides highest precision and minimal thermal impact for all materials. Applications such as microelectronics, semiconductor, and photovoltaic industries use picosecond lasers for maximum quality, flexibility, and cost efficiency. The range of parts, manufactured with ps lasers spans from microscopic diamond tools over large printing cylinders with square feet of structured surface. Cutting glass for display and PV is a large application, as well. With a smart distribution of energy into groups of ps-pulses at ns-scale separation (known as burst mode) ablation rates can be increased by one order of magnitude or more for some materials, also providing a better surface quality under certain conditions. The paper reports on the latest results of the laser technology, scaling of ablation rates, and various applications in ps-laser micromachining.

Paper Details

Date Published: 23 February 2012
PDF: 7 pages
Proc. SPIE 8243, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XVII, 82430I (23 February 2012); doi: 10.1117/12.913626
Show Author Affiliations
Ralf Knappe, LUMERA LASER GmbH (Germany)


Published in SPIE Proceedings Vol. 8243:
Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XVII
Guido Hennig; Xianfan Xu; Bo Gu; Yoshiki Nakata, Editor(s)

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