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Proceedings Paper

Assembly and interconnect formation in MEMS/MOEMS application
Author(s): Hermann Oppermann
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Paper Abstract

Integration of MEMS and MOEMS requires very compact packages with short interconnects which are found in 3D packages. We will give an overview on assembly methods like chip-to-chip, chip-to-wafer and wafer-to-wafer. For the variety of applications different interconnection methods are shown: reflow soldering, transient liquid phase bonding and transient liquid phase soldering, thermocompression and thermosonic bonding as well as sintering of silver paste or new materials like nanosponge.

Paper Details

Date Published: 2 February 2012
PDF: 8 pages
Proc. SPIE 8250, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices XI, 825002 (2 February 2012); doi: 10.1117/12.912820
Show Author Affiliations
Hermann Oppermann, Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (Germany)


Published in SPIE Proceedings Vol. 8250:
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices XI
Sonia M. García-Blanco; Rajeshuni Ramesham, Editor(s)

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