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Proceedings Paper

Emcore's 1 Gb/s to 25 Gb/s VCSELs
Author(s): Neinyi Li; Chuan Xie; Wenlin Luo; Chris J. Helms; Li Wang; Chiyu Liu; Qi Sun; Shenghong Huang; Chun Lei; K. P. Jackson; Rich F. Carson
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Paper Abstract

Emcore's 850 nm UltralaseTM VCSELs, operating at a data rate from 1 Gb/s to 25 Gb/s, is presented. They were based on our low-cost and hermetic-by-design chip platform which contains the same element for either singlets or arrays with a 250 μm pitch. First, we discuss high-speed VCSEL evolutions, device designs, manufacturing processes, and device characteristics. Secondly, we present performance of Emcore's TOSAs, 40 Gb/s parallel optic modules (S12), 120 Gb/s CXP modules, active connect cables (40 Gb/s QDR and 56 Gb/s FDR), as well as comprehensive reliability qualifications of UltralaseTM VCSELs. Lastly, we briefly go over the recent progress of 20 Gb/s and 25 Gb/s VCSEL developments. We have successfully achieved a 3dB bandwidth of 15 GHz at 85°C and 8 mA for a 7.5 μm aperture UltralaseTM VCSEL.

Paper Details

Date Published: 2 February 2012
PDF: 10 pages
Proc. SPIE 8276, Vertical-Cavity Surface-Emitting Lasers XVI, 827603 (2 February 2012); doi: 10.1117/12.912507
Show Author Affiliations
Neinyi Li, EMCORE Corp. (United States)
Chuan Xie, EMCORE Corp. (United States)
Wenlin Luo, EMCORE Corp. (United States)
Chris J. Helms, EMCORE Corp. (United States)
Li Wang, EMCORE Corp. (United States)
Chiyu Liu, EMCORE Corp. (United States)
Qi Sun, EMCORE Corp. (United States)
Shenghong Huang, EMCORE Corp. (United States)
Chun Lei, EMCORE Corp. (United States)
K. P. Jackson, EMCORE Corp. (United States)
Rich F. Carson, EMCORE Corp. (United States)


Published in SPIE Proceedings Vol. 8276:
Vertical-Cavity Surface-Emitting Lasers XVI
Chun Lei; Kent D. Choquette, Editor(s)

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