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Proceedings Paper

Detailed modeling of integrated IQ-transmitters for 100G+ applications
Author(s): A. Richter; C. Arellano; D. Carrara; S. Mingaleev; E. Sokolov; I. Koltchanov
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Paper Abstract

We present techniques for modeling the physics and systems-level characteristics of integrated IQ-transmitters for 100G+ applications and emphasize important design aspects. Using time-and-frequency-domain modeling (TFDM) of Photonic Integrated Circuits (PIC), we present a detailed IQ-transmitter model based on the physics and setup of active and passive subcomponents. With this, we link characteristics of subcomponents (bending loss of waveguides, phase changes in MMI couplers, sweep-out time of EAMs) to systems-level characteristics of the integrated IQ-transmitter (extinction ratio, modulation bandwidth, chirp). Further, a behavioral transmitter model is introduced and utilized to assess electrical driving requirements (allowed jitter, noise, synchronization offset).

Paper Details

Date Published: 25 January 2012
PDF: 8 pages
Proc. SPIE 8284, Next-Generation Optical Communication: Components, Sub-Systems, and Systems, 82840L (25 January 2012); doi: 10.1117/12.912096
Show Author Affiliations
A. Richter, VPIsystems GmbH (Germany)
C. Arellano, VPIsystems GmbH (Germany)
D. Carrara, Telecom SudParis, CNRS (France)
S. Mingaleev, VPI Development Ctr. (Belarus)
E. Sokolov, VPI Development Ctr. (Belarus)
I. Koltchanov, VPIsystems GmbH (Germany)


Published in SPIE Proceedings Vol. 8284:
Next-Generation Optical Communication: Components, Sub-Systems, and Systems
Guifang Li; Dieter Stefan Jäger, Editor(s)

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