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Proceedings Paper

Reconfigurable 2D cMUT-ASIC arrays for 3D ultrasound image
Author(s): Jongkeun Song; Sungjin Jung; Youngil Kim; Kyungil Cho; Baehyung Kim; Seunghun Lee; Junseok Na; Ikseok Yang; Oh-kyong Kwon; Dongwook Kim
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Paper Abstract

This paper describes the design and implementations of the complete 2D capacitive micromachined ultrasound transducer electronics and its analog front-end module for transmitting high voltage ultrasound pulses and receiving its echo signals to realize 3D ultrasound image. In order to minimize parasitic capacitances and ultimately improve signal-to- noise ratio (SNR), cMUT has to be integrate with Tx/Rx electronics. Additionally, in order to integrate 2D cMUT array module, significant optimized high voltage pulser circuitry, low voltage analog/digital circuit design and packaging challenges are required due to high density of elements and small pitch of each element. We designed 256(16x16)- element cMUT and reconfigurable driving ASIC composed of 120V high voltage pulser, T/R switch, low noise preamplifier and digital control block to set Tx frequency of ultrasound and pulse train in each element. Designed high voltage analog ASIC was successfully bonded with 2D cMUT array by flip-chip bonding process and it connected with analog front-end board to transmit pulse-echo signals. This implementation of reconfigurable cMUT-ASIC-AFE board enables us to produce large aperture 2D transducer array and acquire high quality of 3D ultrasound image.

Paper Details

Date Published: 25 February 2012
PDF: 6 pages
Proc. SPIE 8320, Medical Imaging 2012: Ultrasonic Imaging, Tomography, and Therapy, 83201A (25 February 2012); doi: 10.1117/12.911263
Show Author Affiliations
Jongkeun Song, Samsung Electronics Co., Ltd. (Korea, Republic of)
Sungjin Jung, Hanyang Univ. (Korea, Republic of)
Youngil Kim, Samsung Electronics Co., Ltd. (Korea, Republic of)
Kyungil Cho, Samsung Electronics Co., Ltd. (Korea, Republic of)
Baehyung Kim, Samsung Electronics Co., Ltd. (Korea, Republic of)
Seunghun Lee, Samsung Electronics Co., Ltd. (Korea, Republic of)
Junseok Na, Hanyang Univ. (Korea, Republic of)
Ikseok Yang, Hanyang Univ. (Korea, Republic of)
Oh-kyong Kwon, Hanyang Univ. (Korea, Republic of)
Dongwook Kim, Samsung Electronics Co., Ltd. (Korea, Republic of)


Published in SPIE Proceedings Vol. 8320:
Medical Imaging 2012: Ultrasonic Imaging, Tomography, and Therapy
Johan G. Bosch; Marvin M. Doyley, Editor(s)

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