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Proceedings Paper

3D optical interconnects: from research to reality
Author(s): Ruth Houbertz-Krauss; Sönke Steenhusen; Markus B. K. Riester
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Proc. SPIE 8267, Optoelectronic Interconnects XII, 826707; doi: 10.1117/12.910881
Show Author Affiliations
Ruth Houbertz-Krauss, Fraunhofer-Institut für Silicatforschung (Germany)
Sönke Steenhusen, Fraunhofer-Institut für Silicatforschung (Germany)
Markus B. K. Riester, Maris TechCon Technology and R & D Consulting (Austria)


Published in SPIE Proceedings Vol. 8267:
Optoelectronic Interconnects XII
Alexei L. Glebov; Ray T. Chen, Editor(s)

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