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Proceedings Paper

Bidirectional multimode fiber interconnection
Author(s): Rainer Michalzik; Alexander Kern; Dietmar Wahl
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Paper Abstract

We summarize the properties of 850nm wavelength AlGaAs/GaAs-based transceiver chips, monolithically integrating vertical-cavity surface-emitting lasers (VCSELs) and metal-semiconductor-metal (MSM) or PIN-type (p-doped-intrinsic-n-doped) photodiodes. Different chip designs enable half- and full-duplex bidirectional optical interconnection at multiple Gbit/s data rate over a single butt-coupled glass or polymer-clad optical fiber with core diameters ranging from 50 to 200 μm. The chips at both fiber ends are nominally identical and no external optics is required, which leads to lower cost in addition to volume and weight reduction. The commercial availability of such chips would directly enable applications in data communication and sensing networks in various environments such as automotive, home, industrial, in-building, or medical.

Paper Details

Date Published: 7 February 2012
PDF: 9 pages
Proc. SPIE 8276, Vertical-Cavity Surface-Emitting Lasers XVI, 82760I (7 February 2012); doi: 10.1117/12.910485
Show Author Affiliations
Rainer Michalzik, Univ. Ulm (Germany)
Alexander Kern, Univ. Ulm (Germany)
Dietmar Wahl, Univ. Ulm (Germany)


Published in SPIE Proceedings Vol. 8276:
Vertical-Cavity Surface-Emitting Lasers XVI
Chun Lei; Kent D. Choquette, Editor(s)

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