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Proceedings Paper

High-power semiconductor laser array packaged on microchannel cooler using gold-tin soldering technology
Author(s): Jingwei Wang; Lijun Kang; Pu Zhang; Zhiqiang Nie; Xiaoning Li; Lingling Xiong; Xingsheng Liu
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Paper Abstract

High power semiconductor laser arrays have found increased applications in many fields. In this work, a hard soldering microchannel cooler (HSMCC) technology was developed for packaging high power diode laser array. Numerical simulations of the thermal behavior characteristics of hard solder and indium solder MCC-packaged diode lasers were conducted and analyzed. Based on the simulated results, a series of high power HSMCC packaged diode laser arrays were fabricated and characterized. The test and statistical results indicated that under the same output power the HSMCC packaged laser bar has lower smile and high reliability in comparison with the conventional copper MCC packaged laser bar using indium soldering technology.

Paper Details

Date Published: 9 February 2012
PDF: 9 pages
Proc. SPIE 8241, High-Power Diode Laser Technology and Applications X, 82410H (9 February 2012); doi: 10.1117/12.909655
Show Author Affiliations
Jingwei Wang, Xi'an Focuslight Technologies Co., Ltd. (China)
Lijun Kang, Xi'an Focuslight Technologies Co., Ltd. (China)
Pu Zhang, Xi'an Institute of Optics and Precision Mechanics (China)
Zhiqiang Nie, Xi'an Institute of Optics and Precision Mechanics (China)
Xiaoning Li, Xi'an Institute of Optics and Precision Mechanics (China)
Lingling Xiong, Xi'an Institute of Optics and Precision Mechanics (China)
Xingsheng Liu, Xi'an Focuslight Technologies Co., Ltd. (China)
Xi'an Institute of Optics and Precision Mechanics (China)


Published in SPIE Proceedings Vol. 8241:
High-Power Diode Laser Technology and Applications X
Mark S. Zediker, Editor(s)

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