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Proceedings Paper

Rotating optics for laser taper-drilling in research and production
Author(s): David Ashkenasi; Tristan Kaszemeikat; Norbert Mueller; Matthias Schmidt; Hans Joachim Eichler; Maurice Clair; Tino Petsch; Jens Hänel; Markus Lasch; Christian Scholz
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Paper Abstract

Drilling of micro through-holes in defined geometry, i.e. entrance diameter and taper, is gaining in importance in different fields of application and production. To exploit the advantages of laser technology for micro machining, versatile trepanning systems based on rotating optics have been designed and implemented. The advanced trepanning systems enable the controlled adjustment of beam displacement and inclination during operation. With a patented measuring device, the angular position of the rotating optics is determined online. The presented compact and lowweight trepanning systems can drill differently tapered through-holes with a diameter in a range of 50 to 1500 μm. Various solid-state laser sources have been used in combination with the presented laser trepanning system for material ablation. The wavelength und pulse width range from 355 to 1550 nm and sub-ps to 100 ns. The novel trepanning systems have been customized for different applications, ranging from basic research quest to industrial production. This presentation outlines the development steps and application results, accenting laser micro drilling of up to 1 mm thick metal and dielectric samples.

Paper Details

Date Published: 17 February 2012
PDF: 11 pages
Proc. SPIE 8244, Laser-based Micro- and Nanopackaging and Assembly VI, 82440Q (17 February 2012); doi: 10.1117/12.907726
Show Author Affiliations
David Ashkenasi, Laser- und Medizin-Technologie GmbH, Berlin (Germany)
Tristan Kaszemeikat, Laser- und Medizin-Technologie GmbH, Berlin (Germany)
Norbert Mueller, Laser- und Medizin-Technologie GmbH, Berlin (Germany)
Matthias Schmidt, Laser- und Medizin-Technologie GmbH, Berlin (Germany)
Hans Joachim Eichler, Laser- und Medizin-Technologie GmbH, Berlin (Germany)
Technische Univ. Berlin (Germany)
Maurice Clair, 3D-Micromac AG (Germany)
Tino Petsch, 3D-Micromac AG (Germany)
Jens Hänel, 3D-Micromac AG (Germany)
Markus Lasch, 3D-Micromac AG (Germany)
Christian Scholz, 3D-Micromac AG (Germany)


Published in SPIE Proceedings Vol. 8244:
Laser-based Micro- and Nanopackaging and Assembly VI
Friedrich G. Bachmann; Wilhelm Pfleging; Kunihiko Washio; Jun Amako; Willem Hoving; Yongfeng Lu, Editor(s)

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