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Proceedings Paper

Dynamical sequence of Au plasmonic nanopore formation using high energy electron beam exposure
Author(s): T. Yamaguchi; M. J. Park; D. S. Kim; N. K. Park; S. S. Choi
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Paper Abstract

Recently there have been tremendous interests about the fabrication of the solid state nanopore due to the capability of the solid state nanopore as a single molecule sensor. The SiN nanopore and the SiO2 nanopore have been fabricated with high energy electron beam exposure such as transmission electron microscopy, field emission electron microscopy, and focused ion beam sculpting. However, the plasmonic Au nano-pore can be utilized as a nanobio optical sensor due to the 106 fold increase of the Raman signal intensity. Hence, in this report, the fabrication of the plasmonic nanopore with less than ~ 10 nm on the apex of the micronsize pyramidal structure using various high energy electron beam exposure. Under the electron beam exposure of FESEM followed by EPMA, the widening and the shrinking of the Au nanopore were observed depending upon the EPMA probe current. The diameters of the Au nanopore was also reduced successively from ~ 5 nm down to zero using 200 keV TEM. From these experimental results, the dynamics of the nanopore formation are found to depend on the viscosity of the membrane, radiation damage, and evaporation of the materials under high vacuum condition. This fabricated plasmonic nano-pore device can be utilized as geneome sequencing device or a single-molecule sensor.

Paper Details

Date Published: 6 February 2012
PDF: 6 pages
Proc. SPIE 8234, Plasmonics in Biology and Medicine IX, 82341A (6 February 2012); doi: 10.1117/12.907310
Show Author Affiliations
T. Yamaguchi, SunMoon Univ. (Korea, Republic of)
M. J. Park, Korea Military Academy (Korea, Republic of)
D. S. Kim, Seoul National Univ. (Korea, Republic of)
N. K. Park, Seoul National Univ. (Korea, Republic of)
S. S. Choi, SunMoon Univ. (Korea, Republic of)


Published in SPIE Proceedings Vol. 8234:
Plasmonics in Biology and Medicine IX
Tuan Vo-Dinh; Joseph R. Lakowicz, Editor(s)

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