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Proceedings Paper

Programmed resist sidewall profiles using subresolution binary grayscale masks for Si-photonics applications
Author(s): Ofir Gan; Paul Allen; Assia Barkai; Peter Buck; Brid Connolly; Harel Frish; Massimiliano Pindo
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Paper Abstract

In this paper we present a 45-degree mirror created for optical applications utilizing CMOS high-volume manufacturing processes with a gray-scale lithography technique. The process that is presented here was done by creating a 3D pattern in the photoresist and then by transferring the photoresist profile to the Si/SiO2 substrate by specific dry etch processing. We discuss the optimization of the half-tone pattern to achieve the desired resist profile. We achieved smooth sidewalls with various sidewall angles and show that different 3D angles and profiles can be achieved and processed simultaneously.

Paper Details

Date Published: 14 February 2012
PDF: 16 pages
Proc. SPIE 8249, Advanced Fabrication Technologies for Micro/Nano Optics and Photonics V, 82490W (14 February 2012); doi: 10.1117/12.907275
Show Author Affiliations
Ofir Gan, Micron Semiconductor Israel Ltd. (Israel)
Paul Allen, Toppan Photomasks, Inc. (United States)
Assia Barkai, Micron Semiconductor Israel Ltd. (Israel)
Peter Buck, Toppan Photomasks, Inc. (United States)
Brid Connolly, Toppan Photomasks Germany GmbH (Germany)
Harel Frish, Micron Semiconductor Israel Ltd. (Israel)
Massimiliano Pindo, Toppan Photomasks (France) SA (France)

Published in SPIE Proceedings Vol. 8249:
Advanced Fabrication Technologies for Micro/Nano Optics and Photonics V
Winston V. Schoenfeld; Raymond C. Rumpf; Georg von Freymann, Editor(s)

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