Share Email Print
cover

Proceedings Paper

Large area direct fabrication of periodic arrays using interference patterning
Author(s): Andrés F. Lasagni; Teja Roch; Denise Langheinrich; Matthias Bieda; Heidi Perez; Andreas Wetzig; Eckhard Beyer
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Periodic patterned surfaces do not merely provide unique properties, but act as intelligent surfaces capable of selectively influencing multiple functionalities. One of the most recent technologies allowing fabrication of periodic arrays within the micro- and submicrometer scales is Direct Laser Interference Patterning (DLIP). The method permits the direct treatment of the material's surface based on locally induced photothermal or photochemical processes. Furthermore, DLIP is particularly suited to fabricate periodic patterns on planar and non-planar surfaces offering a route to large-scale production. In this paper, the fabrication of spatially ordered structures on different materials such as polymers, metals and diamond like carbon films is discussed. Several application examples as function of the processed material are introduced, including bio functional surfaces for cell guidance on polymers, wear resistant properties for structured diamond carbon like coatings and metals, as well as micro-patterned flexible polymers with controlled optical properties.

Paper Details

Date Published: 17 February 2012
PDF: 10 pages
Proc. SPIE 8244, Laser-based Micro- and Nanopackaging and Assembly VI, 82440F (17 February 2012); doi: 10.1117/12.906758
Show Author Affiliations
Andrés F. Lasagni, Fraunhofer IWS Dresden (Germany)
Teja Roch, Fraunhofer IWS Dresden (Germany)
Technische Univ. Dresden (Germany)
Denise Langheinrich, Fraunhofer IWS Dresden (Germany)
Matthias Bieda, Fraunhofer IWS Dresden (Germany)
Heidi Perez, Fraunhofer IWS Dresden (Germany)
Technische Univ. Dresden (Germany)
Andreas Wetzig, Fraunhofer IWS Dresden (Germany)
Eckhard Beyer, Fraunhofer IWS Dresden (Germany)
Technische Univ. Dresden (Germany)


Published in SPIE Proceedings Vol. 8244:
Laser-based Micro- and Nanopackaging and Assembly VI
Friedrich G. Bachmann; Wilhelm Pfleging; Kunihiko Washio; Jun Amako; Willem Hoving; Yongfeng Lu, Editor(s)

© SPIE. Terms of Use
Back to Top