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Proceedings Paper

Network-based multisensor optical 3D acquisition of complex structures
Author(s): G. Frankowski; R. Hainich
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Paper Abstract

We present new developments in optical 3d sensors using pico DLP as well as DSP technology. We use enhanced, high-powered pico DLP projection units and compact processing hardware to create likewise compact, light-weight measuring heads, which can perform the acquisition as well as the evaluation of 3D data without external computing power. Moreover, their drastically reduced cost and their networking ability also allows for an economical combination of a multitude of individual sensors into complex configurations. The entire form even of large and complex shapes can hereby be scanned in a very short time. New calibration strategies, integrating all individual sensor coordinate systems into a single, calibrated, global one, lead to an immediate combination of all sensor data into a single, complete point cloud. We show the principle and actual realization of sensors, calibration strategies and procedures, and examples of first realized multi-sensor measuring systems utilizing this new technology.

Paper Details

Date Published: 7 February 2012
PDF: 10 pages
Proc. SPIE 8254, Emerging Digital Micromirror Device Based Systems and Applications IV, 825402 (7 February 2012); doi: 10.1117/12.906729
Show Author Affiliations
G. Frankowski, GFMesstechnik GmbH (Germany)
R. Hainich, GFMesstechnik GmbH (Germany)


Published in SPIE Proceedings Vol. 8254:
Emerging Digital Micromirror Device Based Systems and Applications IV
Michael R. Douglass; Patrick I. Oden, Editor(s)

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