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Proceedings Paper

Design of a highly parallel board-level-interconnection with 320 Gbps capacity
Author(s): U. Lohmann; J. Jahns; S. Limmer; D. Fey; H. Bauer
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Paper Abstract

A parallel board-level interconnection design is presented consisting of 32 channels, each operating at 10 Gbps. The hardware uses available optoelectronic components (VCSEL, TIA, pin-diodes) and a combination of planarintegrated free-space optics, fiber-bundles and available MEMS-components, like the DMD™ from Texas Instruments. As a specific feature, we present a new modular inter-board interconnect, realized by 3D fiber-matrix connectors. The performance of the interconnect is evaluated with regard to optical properties and power consumption. Finally, we discuss the application of the interconnect for strongly distributed system architectures, as, for example, in high performance embedded computing systems and data centers.

Paper Details

Date Published: 2 February 2012
PDF: 9 pages
Proc. SPIE 8267, Optoelectronic Interconnects XII, 826706 (2 February 2012); doi: 10.1117/12.905888
Show Author Affiliations
U. Lohmann, FernUniv. in Hagen (Germany)
J. Jahns, FernUniv. in Hagen (Germany)
S. Limmer, Friedrich-Alexander-Univ. Erlangen-Nürnberg (Germany)
D. Fey, Friedrich-Alexander-Univ. Erlangen-Nürnberg (Germany)
H. Bauer, MICROSENS GmbH & Co. KG (Germany)

Published in SPIE Proceedings Vol. 8267:
Optoelectronic Interconnects XII
Alexei L. Glebov; Ray T. Chen, Editor(s)

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