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Proceedings Paper

Hybrid-integrated coherent receiver using silica-based planar lightwave circuit technology
Author(s): Jong-Hoi Kim; Joong-Seon Choe; Kwang-Seong Choi; Chun-Ju Youn; Duk-Jun Kim; Sun-Hyok Jang; Yong-Hwan Kwon; Eun-Soo Nam
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Paper Abstract

A hybrid-integrated coherent receiver module has been achieved using flip-chip bonding technology, consisting of a silica-based 90°-hybrid planar lightwave circuit (PLC) platform, a spot-size converter integrated waveguide photodiode (SSC-WG-PD), and a dual-channel transimpedance amplifier (TIA). The receiver module shows error-free operation up to 40Gb/s and OSNR sensitivity of 11.5 dB for BER = 10-3 at 25 Gb/s.

Paper Details

Date Published: 28 November 2011
PDF: 6 pages
Proc. SPIE 8308, Optoelectronic Materials and Devices VI, 830824 (28 November 2011); doi: 10.1117/12.905571
Show Author Affiliations
Jong-Hoi Kim, Electronics and Telecommunications Research Institute (Korea, Republic of)
Joong-Seon Choe, Electronics and Telecommunications Research Institute (Korea, Republic of)
Kwang-Seong Choi, Electronics and Telecommunications Research Institute (Korea, Republic of)
Chun-Ju Youn, Electronics and Telecommunications Research Institute (Korea, Republic of)
Duk-Jun Kim, Electronics and Telecommunications Research Institute (Korea, Republic of)
Sun-Hyok Jang, Electronics and Telecommunications Research Institute (Korea, Republic of)
Yong-Hwan Kwon, Electronics and Telecommunications Research Institute (Korea, Republic of)
Eun-Soo Nam, Electronics and Telecommunications Research Institute (Korea, Republic of)


Published in SPIE Proceedings Vol. 8308:
Optoelectronic Materials and Devices VI
Guang-Hua Duan, Editor(s)

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