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Proceedings Paper

Robust digital speckle photography based on radon and Fourier-Mellin transforms
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Paper Abstract

We present a new and robust method for determining in-plane displacements of an object from distorted Digital Speckle Photography (DSP) images. This new approach is designed particularly to facilitate accurate measurement of deformations of steel samples during a gas quenching heat treatment process, where rigid body motion and large deformations lead to unwanted image distortions. The new method allows the computation and correction of image rotation and magnification via Radon and Fourier-Mellin Transformations prior to calculations of in-plane displacements, thereby alleviating the inaccuracy that arises from the cross correlation of distorted images in conventional DSP. The method is validated through simulation and measurements with predefined deformations. Initial studies show that the new method is well suited for this application and that it enables measurement of displacements with high accuracy in the micrometer range.

Paper Details

Date Published: 28 November 2011
PDF: 8 pages
Proc. SPIE 8202, 2011 International Conference on Optical Instruments and Technology: Solid State Lighting and Display Technologies, Holography, Speckle Pattern Interferometry, and Micro/Nano Manufacturing and Metrology, 82020A (28 November 2011); doi: 10.1117/12.904375
Show Author Affiliations
E. N. Kamau, Bremer Institut für angewandte Strahltechnik GmbH (Germany)
C. Falldorf, Bremer Institut für angewandte Strahltechnik GmbH (Germany)
C. von Kopylow, Bremer Institut für angewandte Strahltechnik GmbH (Germany)
R. B. Bergmann, Bremer Institut für angewandte Strahltechnik GmbH (Germany)


Published in SPIE Proceedings Vol. 8202:
2011 International Conference on Optical Instruments and Technology: Solid State Lighting and Display Technologies, Holography, Speckle Pattern Interferometry, and Micro/Nano Manufacturing and Metrology
Hoi Sing Kwok; Fengzhou Fang; Lian Xiang Yang; Chongxiu Yu; Albert A. Weckenmann; Yanbing Hou; Jinxue Wang; Ji Zhao; Jinxue Wang; Peter Zeppenfeld; Boyu Ding; Boyu Ding; Liquan Dong; Liquan Dong; Jack K. Luo; Boyu Ding; Liquan Dong; Jinxue Wang, Editor(s)

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