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Proceedings Paper

Micrometric measurement of thermally induced efforts using digital holographic interferometry
Author(s): Freddy Monroy; J. Garcia-Sucerquia
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Paper Abstract

The change of temperature of an object introduces variation of the objects dimensions. These dimensional changes that are in the micrometer scale, can have undesired consequences as for example the decoupling of soldering points in electronic circuits. In this work we present a system based on digital interferometry to quantify the dimensional change induced on an electronic circuit board as it operates. In digital holographic interferometry of double exposure two holograms of the object are registered for different temperatures. The holograms are registered by a solid state detector and transferred to a computer; thereafter the recordings are reconstructed numerically using Fresnel's approximation. The amplitude and the phase of the complex optical field reflected by the object can be recovered. The resulting phase map is converted into micrometer dimensional variations by means of a lookup table generated previously. The lookup table is computed by calibrating phase maps obtained when known mechanical displacements are introduced over an object. We present experimental results of deformations in the range of 0, 5 μm to 4 μm for a regular circuit board.

Paper Details

Date Published: 3 November 2011
PDF: 8 pages
Proc. SPIE 8011, 22nd Congress of the International Commission for Optics: Light for the Development of the World, 801182 (3 November 2011); doi: 10.1117/12.903408
Show Author Affiliations
Freddy Monroy, Univ. Nacional de Colombia Sede Bogotá (Colombia)
J. Garcia-Sucerquia, Univ. Nacional de Colombia Sede Medellín (Colombia)


Published in SPIE Proceedings Vol. 8011:
22nd Congress of the International Commission for Optics: Light for the Development of the World
Ramón Rodríguez-Vera; Ramón Rodríguez-Vera; Ramón Rodríguez-Vera; Rufino Díaz-Uribe; Rufino Díaz-Uribe; Rufino Díaz-Uribe, Editor(s)

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