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Proceedings Paper

A review on carbon-based materials as on-chip interconnects
Author(s): Hatef Sadeghi; Jean-Michel Redouté; Daniel T. H. Lai; M. T. Ahmadi; Razali Ismail
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Paper Abstract

Interconnect wires are major technology components of modern high-speed integrated circuits. To overcome the latter's degradation caused by increasing miniaturization, there is an urgent need to look for alternative technologies. Since carbon based materials generate promising results, this paper focuses on describing the electrical properties of carbon based materials, in particular the use of graphene nanoribbon (GNR) as well as trilayer graphene nanoribbon (TGN) as next generation interconnects: since the conductance of TGN is less affected by external fields compared to GNR, it forms an improved choice for on-chip interconnects. The conductance model of TGN is derived and discussed in detail.

Paper Details

Date Published: 23 December 2011
PDF: 8 pages
Proc. SPIE 8204, Smart Nano-Micro Materials and Devices, 82042O (23 December 2011); doi: 10.1117/12.903196
Show Author Affiliations
Hatef Sadeghi, Univ. Teknologi Malaysia (Malaysia)
Jean-Michel Redouté, Monash Univ. (Australia)
Daniel T. H. Lai, Victoria Univ. (Australia)
M. T. Ahmadi, Univ. Teknologi Malaysia (Malaysia)
Razali Ismail, Univ. Teknologi Malaysia (Malaysia)


Published in SPIE Proceedings Vol. 8204:
Smart Nano-Micro Materials and Devices
Saulius Juodkazis; Min Gu, Editor(s)

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