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Proceedings Paper

Reduction of the 355-nm laser-induced damage initiators by removing the subsurface cracks in fused silica
Author(s): Minghong Yang; Hongji Qi; Yuanan Zhao; Kui Yi
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Paper Abstract

The 355 nm laser-induced damage thresholds (LIDTs) of polished fused silica with and without the residual subsurface cracks were explored. HF based wet etching and magnetorheological finishing was used to remove the subsurface cracks. To isolate the effect of subsurface cracks, chemical leaching was used to eliminate the photoactive impurities in the polishing layer. Results show that the crack number density decreased from~103 to <1cm-2, and the LIDT was improved as high as 2.8-fold with both the subsurface cracks and the polishing layer being removed. Subsurface cracks play a significant role in laser damage at fluencies between 15~31 J/cm2 (355nm, 8ns). HF Etching of the cracks was shown to increase the damage performance as nearly high as that of the samples in which subsurface cracks are well controlled.

Paper Details

Date Published: 12 January 2012
PDF: 7 pages
Proc. SPIE 8206, Pacific Rim Laser Damage 2011: Optical Materials for High Power Lasers, 82061C (12 January 2012); doi: 10.1117/12.903037
Show Author Affiliations
Minghong Yang, Shanghai Institute of Optics and Fine Mechanics (China)
Graduate School of Chinese Academy of Sciences (China)
Hongji Qi, Shanghai Institute of Optics and Fine Mechanics (China)
Yuanan Zhao, Shanghai Institute of Optics and Fine Mechanics (China)
Kui Yi, Shanghai Institute of Optics and Fine Mechanics (China)


Published in SPIE Proceedings Vol. 8206:
Pacific Rim Laser Damage 2011: Optical Materials for High Power Lasers
Jianda Shao, Editor(s)

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